The EG6000 300mm wafer prober is a highly accurate system that keeps longevity, reliability, wafer throughput, and most importantly test repeatability in mind.

• Active vibration cancellation allows for consistent contact resistance, reducing yield loss from vibration.
• 50 nanometer Z accuracy with grid-based surface mapping, closed-loop chuck positioning, and advances probe-to-pad alignment algorithms.
• Quickly test between temperatures of -40°C and 120°C without having to remove the lot.